l overview

these bluetooth modules are ble rf modules. with advantages of low power consumption, compact design, long transmission distance and strong anti-interference capability, the modules embedded with high performance ifa, can be widely used in low power local area network communication.

rf-bm-nd05 built upon chip nordic52840. the module can be used to develop consumer electronic products and phone peripherals over ble 5.0. it provide a  quick ble solution for the communication between customer’s products to mobile devices.

l module parameters

pin assignment

 
 
figure 1 pin assignment
 

package size

thickness of the module is 2.3 ± 0.1 mm。
 
 
figure 2 package size

layout proposals

the serpentine antenna on pcb is free space electromagnetic radiation. the place and layout range are keys to enhance the data rate and transmit range.

thus，below are the layout proposals for antenna and route:

1, place the antenna on the edge(corner) of the pcb backplane.

2, make sure there is no signal or copper foil in each layer.

3, hollowing out the yellow pane part (figure 3) to make less s11 interference.

 
figure 3
 

recommended operating conditions

notes：

(1) the operating temperature is limited to the change of crystal’s frequency.

(2) to ensure the rf performance, the ripple wave of the source must be less than 300mv.

reflow conditions

1. heating mode：conventional convection or ir convection；

2. times allowed to reflow: 2 times, for the below reflow (conditions)（figure 4）；

3. temperature curve: the reflow should be in accordance with the temperature curve shown below (figure 4)；

4. highest：245°c。
 

figure 4 parts’ heat-resistance temperature curve for welding(welding point）

 
electrostatic discharge 

module will be damaged for the discharge of static, rf star suggest that all modules should follow the 3 precautions below.:

1. according to the anti-static measures, bare hands are not allowed to touch modules.

2. modules must be placed in anti- static areas.

3. take the anti-static circuitry(when inputting hv or vhf) into consideration in product design. static may result in the degradation in performance of module, even causing the failure.